Technical Specifications
Chemical
Composition of Copper
| Material |
Normal
Composition |
Nearest
Relevant Composition Specification |
|
|
BS:2870 |
ISO |
JIS |
Electrolytic Tough
Pitch H.C. Copper |
99.92% Min.
Cu |
C 101 |
Cu ETP
1337 |
H 3100
C 2100 |
| Phosphorous Deoxidized
Copper (DONA) |
99.90% Min.
Cu
P.0.0134-0.05 |
C 106 |
Cu DHP
1337 |
H 3100
C 1220 |
SPECIFICATIONS
Material |
Tensile temper strength elongation N/mm% on 50 mm |
Vickers Hardness |
Complies with or falls within ISO |
JIS |
| |
'O' |
210 Min 35 Min |
55 Max |
|
|
| Electrolytic Tough |
M |
210 Min 35 Min |
65 Min |
Cu ETP |
H 3100 |
| Pitch H.C. Copper |
½H |
240 Min 10 Min |
70 to 95 |
ISO : 1337 |
C 1100 |
| |
H |
290 Min |
90 Min |
|
|
| |
'O' |
210 Min 35 Min |
55 Max |
|
|
| Phosphorous |
M |
210 Min 35 Min |
65 Min |
Cu DHP |
H 3100 |
| Deoxidised Copper |
½H |
240 Min 10 Min |
70 to 95 |
ISO : 1337 |
C 1220 |
|
H |
290 Min |
90
Min |
|
|
'O' : Annealed Condition
M : 1/4 Hard
1/2 : Half Hard
H : Full Hard
* : Electrical conductivity at 20°. Cel(% IACS) - 100-101 (For Cu ETP 'O' temper)
